The main structure of the plant of the CEC project is capped.

Changsha High-tech Zone News showed that on the morning of September 28, the CLP Integrated Circuit Complete Equipment Localization Integration and Verification Platform Construction Project (hereinafter referred to as “CLP Project”) ushered in the main structure of the plant.

According to reports, the CEC project is one of the key construction projects in Changsha High-tech Zone in 2019. It is dedicated to solving the problem of the key equipment of integrated circuits being subject to the "card neck" problem, building an 8-inch integrated circuit equipment verification process line, and driving the development of domestic equipment. An important project to build a system to build domestic equipment.

With a total investment of 2.5 billion yuan, the project is the first integrated circuit equipment verification process line in China. Its completion will effectively promote the rapid development of the military-civilian integration industry in the high-tech zone and promote the independent and controllable development of key core technologies in this field. It is reported that after the project is completed, it will provide standardized integrated circuit equipment for the domestic market and provide credible foundry for military and civilian chips. The main achievements of the project will be integrated circuit equipment, integrated line integration and military and civilian chips.

In November 2018, the project was officially launched. Now the main structure is capped. The project will enter the decoration and decoration project in October. It is expected that the installation and commissioning will be completed in June 2020, and the whole line trial production will be realized in November 2020.