The growth slows down, how does the IC packaging and testing industry fill the short board?

Recently, China Semiconductor Packaging and Testing Technology and Market Annual Meeting was held in Wuxi. With the theme of “integrated innovation, intelligent manufacturing, collaborative development, and shared win-win”, industry experts and scholars focus on the core of the semiconductor packaging and testing industry, and discuss the hot issues of advanced packaging technology, packaging and testing technology, equipment and materials. .

China's packaging and testing industry is slowing down

5G+AI brings a new round of development opportunities

According to the statistics of China Semiconductor Industry Association Packaging Branch, the growth of IC packaging and test industry in China has slowed down in 2018. The sales revenue of packaging and testing industry increased from 181.66 billion yuan in 2017 to 196.56 billion yuan, up only 8.2% year-on-year.

By the end of 2018, there were 99 IC packaging and testing enterprises of a certain size in China, a slight increase year-on-year. The annual productivity growth rate is obvious, reaching 25%.

Liu Wei, chairman of the China Semiconductor Industry Association Packaging Branch, said in his speech that with the advent of the 5G and AI eras and the continuous advancement of enterprise technology, as an important part of the IC industry chain, the packaging technology field is welcoming. Come to a new round of development opportunities.

Revolutionary changes in 5G communications, big data, cloud computing, Internet of Things, automotive electronics, medical, industrial automation, smart cities, etc., will further drive the growth of semiconductor emerging markets.

In the guest speech session, Liu Wei pointed out that there is still a big gap between China's IC packaging and testing industry and the world-class level. In the future, we must continue to vigorously strengthen innovation and construction. Driven by the emerging market of 5G+AI, with the strong support of the country and the efforts of the enterprise itself, the future development of the integrated circuit industry should build a global cooperation platform through integrated innovation, intelligent manufacturing, coordinated development, and shared win-win. Improve the research and development capabilities of independent core technologies, strengthen personnel training and management innovation, strengthen and expand, and promote the high-quality development of IC packaging and testing industry.

Solve card neck problems

Achieve high quality innovation and development

At the annual meeting, Ye Tianchun, the head of the National Science and Technology Major Special Project 02 expert group, said that during the golden period of the past decade, China's packaging and testing industry has completed the process from catching up to entering the world's forefront. In the new round of planning, the packaging and testing industry will solve the problem of the card neck by 2035, achieve high-quality development and highlight innovation.

Ye Tianchun believes that China's IC industry has entered a new stage and established a relatively complete technical system and industrial strength. Under the current situation, what is most needed is strategic determination. We must dare to adhere to the effective practices proven by practice and improve and improve them.

The problem of "short board" cannot be dealt with in isolation and passively. It must be systematically planned. It is necessary to improve the overall ability and establish the local advantages to form a competition check and balance.

Independent innovation is not "innovation by itself", and open cooperation must be adhered to. The key lies in how to exploit the potential of the Chinese market, open up new space, master core technologies, and move from the low end of the value chain to the high end in the global industrial division of labor.

In the development of the integrated circuit industry, the “three-chain integration” of the industrial chain, the innovation chain and the financial chain is the only way. China needs a more professional investment and financing platform and more relaxed credit policy support.

Opportunities and challenges coexist

The packaging and testing industry presents a new trend

Data show that global integrated circuit industry sales fell by more than 14% from 2013 to 2019. According to the statistics of China Semiconductor Industry Association, the sales growth of China's IC industry in 2013-2019 is about 7%.

China's integrated circuit industry has shown rapid development momentum, but at the same time it also faces the adverse effects caused by internal and external factors such as insufficient accumulation of its own and weak integration of value chain. Insufficient genetics, inheritance and patience; weak industrial base, difficult to catch up in the short term; insufficient R&D expenses, difficult to form economies of scale; weak and small industries, enterprises face homogenization competition; lack of talents in the integrated circuit field, restricting industrial development.

When Zhao Haijun, CEO of SMIC IC Manufacturing Co., Ltd. spoke, he shared five points on the development trend of IC packaging and testing industry. First, Moore's Law dividends are gradually losing, but the complexity of the system will continue to follow the original track. Go on. Second, the cost of the learning curve of process technology is too high. A large chip can be divided into several small chips to produce, and the yield rate is greatly improved, and the upgrade is completed in advance. Third, the development cost of the new generation of large-chip full coverage is too high, and the reuse of the original node design IP can save cost and time. Fourth, monolithic performance is a serious loss in functional combination, requiring a multi-chip solution. Fifth, different Chiplets need to be designed together, and OSAT can provide public IP.